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Casa. > prodotti > Carburo di silicio Ceramiche > Silicon Carbide Ceramics Offering Thermal Shock Resistance And High Temperature Stability For In Semiconductor Crystal Growth Furnaces

Silicon Carbide Ceramics Offering Thermal Shock Resistance And High Temperature Stability For In Semiconductor Crystal Growth Furnaces

Dettagli del prodotto

Luogo di origine: CN

Marca: Dayoo

Termini di pagamento e di spedizione

Quantità di ordine minimo: Personalizzato

Prezzo: CNY

Imballaggi particolari: Pacchetto

Tempi di consegna: 60 giorni lavorativi

Capacità di alimentazione: Fabbrica

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Evidenziare:

silicon carbide ceramics thermal shock resistance

,

high temperature stability silicon carbide ceramics

,

semiconductor crystal growth furnace ceramics

Modulo di elasticità:
300-330 Gpa
Servizio di elaborazione:
Elaborazione personalizzata
Contenuto:
99% SIC
Materiale:
Carburo di silicio (SiC)
Densità:
3,1 - 3,2 G/cm³
Inerzia chimica:
Alto
Resistenza all'abrasione:
Eccellente
Forma del prodotto:
Rollo di disco
Resistenza alla flessione:
300 - 550MPa
Metodi di produzione:
Sinterizzazione, bonding a reazione, pressatura a caldo
Vantaggio:
Resistente alle alte temperature.
forza di flessione:
Mpa 450
Microne:
150
Controllo qualità:
Ispezione al 100%.
Caratteristica:
Resistenza alle alte temperature
Modulo di elasticità:
300-330 Gpa
Servizio di elaborazione:
Elaborazione personalizzata
Contenuto:
99% SIC
Materiale:
Carburo di silicio (SiC)
Densità:
3,1 - 3,2 G/cm³
Inerzia chimica:
Alto
Resistenza all'abrasione:
Eccellente
Forma del prodotto:
Rollo di disco
Resistenza alla flessione:
300 - 550MPa
Metodi di produzione:
Sinterizzazione, bonding a reazione, pressatura a caldo
Vantaggio:
Resistente alle alte temperature.
forza di flessione:
Mpa 450
Microne:
150
Controllo qualità:
Ispezione al 100%.
Caratteristica:
Resistenza alle alte temperature
Silicon Carbide Ceramics Offering Thermal Shock Resistance And High Temperature Stability For In Semiconductor Crystal Growth Furnaces
Silicon Carbide Ceramics for Semiconductor Crystal Growth Furnaces
Product Overview

Silicon Carbide (SiC) Precision Ceramics are high-performance industrial ceramic materials manufactured using high-purity SiC powder (purity ≥ 98%) through advanced forming and high-temperature sintering processes. These materials provide exceptional thermal shock resistance, high temperature stability, and strong corrosion resistance, making them essential components for high-end industrial thermal equipment operating in extreme conditions from 1600-1900°C.

Core Applications
  • High-Temperature Furnace Linings: Suitable for SiC sintering furnaces, vacuum/atmosphere sintering furnaces, glass melting kilns, and hazardous waste incinerators, providing high-temperature and corrosion-resistant inner lining protection
  • Thermocouple Protection Tubes: Used in semiconductor crystal growth furnaces, metal melting furnaces, and cemented carbide sintering furnaces, ensuring accurate operation of temperature measurement elements under reducing/inert atmospheres
Product Advantages
  • High-Temperature Resistance: Decomposition temperature >2500°C under atmospheric pressure; flexural strength at 1400°C remains over 70% of room temperature strength
  • Thermal Shock Resistance: Thermal expansion coefficient of 4.3-4.5×10⁻⁶/K, capable of withstanding sudden temperature fluctuations >500°C
  • Corrosion and Wear Resistance: Resistant to strong acids (except hydrofluoric acid), molten metals, and slag erosion; hardness ranges from 2400-2600 kg/mm²
  • Precision and Stability: High forming accuracy; pressureless sintered products achieve density ≥98%; excellent thermal conductivity (104-200 W/m*K)
Technical Specifications
Item Indicator
SiC Content ≥98%
Density 3.02-3.10 g/cm³
Maximum Operating Temperature 1900°C
Thermal Expansion Coefficient (25°C) 4.3×10⁻⁶/K
Flexural Strength (Room Temperature) ≥395 MPa
Hardness (HV) 2400-2600 kg/mm²
Porosity ≤0.1 vol% (Reaction Sintered)
Manufacturing Process

Raw Material Pretreatment (Purification → Ball Milling) → Forming (Isostatic Pressing / Slip Casting / Extrusion) → High-Temperature Sintering (1400-2200°C) → Precision Machining (Grinding → Polishing) → Performance Testing (Strength / Corrosion Resistance Testing) → Finished Product Packaging

Usage Instructions
  • Clean contact surfaces before installation to ensure no impurities
  • Avoid sudden cooling or heating; heating/cooling rates should be ≤5°C/min
  • Preheat to 80°C and maintain for 2 hours before use in low-temperature environments (<15°C)
  • Keep away from strongly corrosive media such as hydrofluoric acid
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